Chipbond Tech Headquarters Lobby Design

Chipbond Tech Headquarters Lobby Design — IADA 2025 award

Chipbond Tech Headquarters Lobby Design received Bronze Winner recognition at the International Architecture & Design Awards 2025 in Corporate Interior Design. Project status, design team and credits are listed alongside the presentation.

About the project

In recent years, Taiwan’s optoelectronics industry has invested over NT$100 billion in developing TFT-LCD panels and related peripheral components, surpassing South Korea to become the largest market in the world. Chipbond Tech is a leading company in Taiwan, specializing in the full-process packaging and testing technology of driver ICs. It is also the largest packaging and testing service provider globally.

The main functions of packaging (Chip Scale Package, CSP) are twofold: first, to provide impact protection, safeguarding against external forces, moisture, and chemical damage, while facilitating the dissipation of heat during operation to create a healthy working environment. Second, it serves as an interface for signal transmission, linking external input signals and the output signals generated by the IC, ensuring that the signals are delivered to the correct destination. Conceptually, we aim to create a friendly and healthy working environment that connect with the company’s image and culture.

Acoustics, Ventilation, Lighting
Optimal Acoustic Environment: The lobby serves as a primary “pin” for information exchange. We sought to continue the design theme from the lobby’s exterior curtain wall into the ceiling, symbolizing the pulse of technology. Lightweight acoustic materials were used to minimize sound reverberation and echo, creating a comfortable acoustic environment.

Comfortable Ventilation: In high-ceiling spaces, using overhead air vents can be energy-intensive and inefficient for cooling. Therefore, we leveraged the opportunity of the interior design to extend the air conditioning ducts into a side-return airflow convection system.

Energy-efficient Lighting: The lobby space is designed with south-facing windows to maximize natural light. Artificial lighting supplements key areas and enhances the overall design. We used durable, energy-efficient LED fixtures to reduce carbon emissions.

Form, Concept, Massing
The design translates the components of circuit boards—such as traces, pins, and chips—into spatial forms, creating a bespoke atmosphere that responds to Chipbond Tech’s product features and corporate culture. This approach fosters a sense of achievement and well-being within the workplace, promoting a thriving communal environment.

WSAA Design Team

The Lead Architect, WENG SUNG HAO (翁崧豪), graduated from National Cheng Kung University, made a notable debut in the academic field with exceptional academic achievements and remarkable design talent, marking the beginning of his architectural journey.

During his time as a project manager at a large architectural firm, WENG gained extensive experience, consistently excelled in various design competitions, and earned high praise from clients.

In 2017, he founded his own firm, "WSAA Design Team" (公羽山松), named after a deconstruction of his own name. This name embodies his philosophy that architecture is a response to history, culture, nature, and life. His architectural works consistently resonate with people, and he continues to integrate this belief into every design, infusing new vitality and charm into the field of architecture.